클라이언트 SSD
NVMe™ SSD M.2

BG4 시리즈는 최대 1,024GB 용량을 제공하는 소형 단일 패키지 NVMe™ SSD 제품군으로, PCIe® Gen3 x4 인터페이스와 KIOXIA 96층 TLC BiCS FLASH™를 활용합니다. 더 높은 대역폭과 향상된 플래시 관리 및 호스트 메모리 버퍼(HMB) 기술을 갖춘 BG4 SSD는 단일 패키지 SSD에서 최대 2,300MB/s(순차 읽기) 및 최대 390K IOPS(랜덤 읽기)가 가능한 동급 최고의 읽기 성능과 최대 3.7W(Typ.)의 유효 전력 소비를 제공합니다.

BG4 시리즈는 128GB, 256GB, 512GB, 1,024GB의 4가지 용량으로 표면 장착형 M.2 1620 단일 패키지 또는 이동식 M.2230 모듈 폼 팩터 옵션으로 제공되므로 데이터 센터의 임베디드 장치와 서버 부팅을 위한 얇고 가벼운 시스템 설계에 적합합니다.
BG4 시리즈에는 TCG Opal 버전 2.01을 지원하는 자체 암호화 드라이브(SED) 모델 옵션이 있습니다.

문서

주요 기능

KIOXIA 96층 BiCS FLASH™

PCIe® Gen3 x4 / NVMe™

최대 1,024GB의 용량

M.2 1620 단일 패키지 및 M.2 2230 단면 폼 팩터

TCG Opal 2.01 SED용 옵션

주요 애플리케이션

  • 울트라 모바일 PC
  • 2-in-1 노트북 PC
  • IoT/내장 장치
  • 서버 및 스토리지 어레이 부트 드라이브

사양

표면 장착 M.2 타입 1620 단일 패키지

* 테이블은 가로로 스크롤할 수 있습니다.

Base Model NumberKBG40ZPZ1T02KBG40ZPZ512GKBG40ZPZ256GKBG40ZPZ128G
Capacity1,024 GB512 GB256 GB128 GB
Basic Specifications
Form FactorM.2 1620-S3 Single packageM.2 1620-S2 Single package
Connector Type-
lnterfacePCIe® Gen3 x4, NVMe™ 1.3b
Maximum Interface Speed32 GT/s (Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read2,300 MB/s2,200 MB/s2,000 MB/s
Sequential Write1,800 MB/s1,400 MB/s800 MB/s
Random Read390 K IOPS330 K IOPS200 K IOPS
Random Write200 K IOPS190 K IOPS150 K IOPS
Reliability
MTTF1,500,000 hours
Power Requirements
Supply Voltage3.3 V ± 5 %, 1.8 V ±5 %,1.2 V ±5 %
Power Consumption (Active)3.4 W typ.3.1 W typ.3.2 W typ.3 W typ.
Power Consumption (L1.2 mode)5 mW typ.
Dimensions
Height1.5 mm Max.1.3 mm Max.
Width16.0 mm Max.
length20.0 mm Max.
Weight1.0 g Max.0.85 g Max.
Environmental
Temperature (Operating)0 ~ 85 °C(TSMART)
Temperature(Non-operating)-40 ~ 85 °C
Vibration (Operating/Non-operating)-
Shock (Operating/Non-operating)-
More features・Host Memory Buffer feature is supported.
・SLC cache is supported.
・Sanitize command is supported.
탈착식 M.2 타입 2230 모듈

* 테이블은 가로로 스크롤할 수 있습니다.

Base Model NumberKBG40ZNS1T02KBG40ZNS512GKBG40ZNS256GKBG40ZNS128G
Capacity1,024 GB512 GB256 GB128 GB
Basic Specifications
Form FactorM.2 2230-S3 Single-sidedM.2 2230-S2 Single-sided
Connector TypeM.2 M
lnterfacePCIe® Gen3 x4, NVMe™ 1.3b
lnterface Speed32 GT/s (Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read2,300 MB/s2,200 MB/s2,000 MB/s
Sequential Write1,800 MB/s1,400 MB/s800 MB/s
Random Read390 K IOPS330 K IOPS200 K IOPS
Random Write200 K IOPS190 K IOPS150 K IOPS
Reliability
MTTF1,500,000 hours
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)3.7 W typ.3.5 W typ.3.6 W typ.3.4 W typ.
Power Consumption (L1.2 mode)5 mW typ.
Dimensions
Height2.38 mm Max.2.23 mm Max.
Width22.0 mm Max.
length30.0 mm Max.
Weight2.6 g Max.2.5 g Max.
Environmental
Temperature (Operating)0 ~ 85 °C(TSMART)
Temperature(Non-operating)-40 ~ 85 °C
Vibration (Operating/Non-operating)196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz )
Shock (Operating/Non-operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features・Host Memory Buffer feature is supported.
・SLC cache is supported.
・Sanitize command is supported.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • 1 MB (megabyte) = 1,000,000 bytes.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • TSMART : Composite Temperature in SMART/Health Information
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of their respective companies.
  • All information provided here is subject to change without prior notice.

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