bg6_001 이미지

클라이언트 NVMe™ SSD

KIOXIA BG6 시리즈는 최대 2,048GB의 용량을 갖춘 컴팩트 폼 팩터 NVMe™ SSD 라인업으로, PCIe® 4.0, NVMe™ 1.4c 사양 호환 인터페이스 및 KIOXIA BiCS FLASH™ 6세대 TLC 플래시 메모리*를 활용합니다. 더 높은 대역폭과 향상된 플래시 관리 및 호스트 메모리 버퍼(HMB) 기술을 갖춘 BG6 시리즈 SSD는 컴팩트 폼 팩터 SSD로 최대 6,000MB/s(순차 읽기) 및 최대 900K IOPS(랜덤 읽기)의 매우 높은 읽기 성능을 제공합니다.

KIOXIA BG6 시리즈 SSD는 M.2 타입 2230 및 2280 모듈 폼 팩터에서 256GB, 512GB, 1,024GB 및 2,048GB의 용량으로 제공되므로 초박형 PC, 임베디드 장치 및 데이터 센터의 서버 부팅과 같은 얇고 가벼운 시스템 설계에 적합합니다. KIOXIA BG6 시리즈는 TCG Opal 버전 2.01을 지원하는 자체 암호화 드라이브(SED) 모델 옵션을 제공합니다.

  • 256GB 및 512GB 용량 BG6 SSD를 위한 KIOXIA BiCS FLASH™ 5세대 TLC 플래시 메모리

문서

주요 기능

  • KIOXIA BiCS FLASH™ 6세대 TLC 플래시 메모리(256GB 및 512GB용 KIOXIA BiCS FLASH™ 5세대 TLC 플래시 메모리)
  • PCIe® 4.0, NVMe™ 1.4 사양 준수
  • 최대 용량 2,048GB
  • M.2 타입 2230 및 2280 단면 폼 팩터
  • TCG Opal 2.01 SED 옵션
     

주요 애플리케이션

  • 울트라 모바일 PC
  • 2-in-1 노트북 PC
  • IoT/내장 장치
  • 서버 및 스토리지 어레이 부트 드라이브

사양

M.2 타입 2230 모듈 폼 팩터

* 테이블은 가로로 스크롤할 수 있습니다.

Base Model NumberKBG60ZNS2T04KBG60ZNS1T02KBG60ZNS512GKBG60ZNS256G
SED Model NumberKBG6AZNS2T04KBG6AZNS1T02KBG6AZNS512GKBG6AZNS256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2230-S3 Single-sidedM.2 2230-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 1.4c
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read6,000 MB/s4,800 MB/s4,400 MB/s
Sequential Write5,300 MB/s5,000 MB/s4,000 MB/s3,000 MB/s
Random Read900K IOPS650K IOPS350K IOPS
Random Write900K IOPS850K IOPS700K IOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.4 W typ.4.3 W typ.4.7 W typ.4.3 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length30 mm ± 0.15 mm
Weight3.0 g Max2.9 g Max2.8 g Max2.7 g Max
Environmental
Temperature (Operating)0 ℃ to 95 ℃ (Controller Temperature)
Temperature (Operating)0 ℃ to 85 ℃ (Other Components Temperature)
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
M.2 타입 2280 모듈 폼 팩터

* 테이블은 가로로 스크롤할 수 있습니다.

Base Model NumberKBG60ZNV2T04KBG60ZNV1T02KBG60ZNV512GKBG60ZNV256G
SED Model NumberKBG6AZNV2T04KBG6AZNV1T02KBG6AZNV512GKBG6AZNV256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2280-S3 Single-sidedM.2 2280-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 1.4c
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read6,000 MB/s4,800 MB/s4,400 MB/s
Sequential Write5,300 MB/s5,000 MB/s4,000 MB/s3,000 MB/s
Random Read900K IOPS650K IOPS350K IOPS
Random Write900K IOPS850K IOPS700K IOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.4 W typ.4.3 W typ.4.7 W typ.4.3 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length80 mm ± 0.15 mm
Weight6.0 g Max5.9 g Max5.8 g Max5.7 g Max
Environmental
Temperature (Operating)0 ℃ to 95 ℃ (Controller Temperature)
Temperature (Operating)0 ℃ to 85 ℃ (Other Components Temperature)
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.
  • All information provided here is subject to change without prior notice.

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