bg7 이미지
bg7 이미지(M.2 유형 2230-S2)
bg7 이미지(M.2 유형 2242-S2)
bg7 이미지(M.2 유형 2280-S2)

클라이언트 NVMe™ SSD

KIOXIA BG7 시리즈는 최대 2,048GB의 용량을 갖춘 컴팩트 폼 팩터 NVMe™ SSD 라인업으로, PCIe® 4.0, NVMe™ 2.0d 사양 호환 인터페이스 및 KIOXIA BiCS FLASH™ 8세대 TLC 플래시 메모리*를 활용합니다. 더 높은 대역폭과 향상된 플래시 관리 및 호스트 메모리 버퍼(HMB) 기술을 갖춘 BG6 시리즈 SSD는 컴팩트 폼 팩터 SSD로 최대 7,000MB/s(순차 읽기) 및 최대 1,000K IOPS(랜덤 읽기)의 매우 높은 읽기 성능을 제공합니다.

KIOXIA BG7 시리즈 SSD는 M.2 타입 2230, 타입 2242 및 타입 2280 모듈 폼팩터로 256GB, 512GB, 1,024GB 및 2,048GB 용량으로 제공되어 초슬림 PC 및 AI PC와 같은 얇고 가벼운 시스템 설계에 적합합니다. BG7 시리즈는 TCG Opal 버전 2.01을 지원하는 자체 암호화 드라이브(SED) 모델 옵션을 제공합니다.

  • KIOXIA BiCS FLASH™ 6세대 TLC 플래시 메모리(256GB BG7 SSD) 문서

문서

주요 기능

  • KIOXIA BiCS FLASH™ 8세대 TLC 플래시 메모리(256GB용 KIOXIA BiCS FLASH™ 6세대 TLC 플래시 메모리)
  • PCIe® 5.0, NVMe™ 2.0d 사양 준수
  • 최대 용량 2,048GB
  • M.2 타입 2230, 타입 2242 및 타입 2280 단면형 폼팩터
  • TCG Opal 2.01 SED 옵션

주요 애플리케이션

  • 울트라 모바일 PC
  • AI PC
  • 2-in-1 노트북 PC

* 테이블은 가로로 스크롤할 수 있습니다.

Base Model NumberKBG70ZNS2T04KBG70ZNS1T02KBG70ZNS512GKBG70ZNS256G
SED Model NumberKBG7BZNS2T04KBG7BZNS1T02KBG7BZNS512GKBG7BZNS256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2230-S3 Single-sidedM.2 2230-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 2.0d
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s6,400 MB/s
Sequential Write6,000 MB/s5,000 MB/s4,000 MB/s
Random Read1,000 KIOPS850 KIOPS550 KIOPS500 KIOPS
Random Write1,000 KIOPS920 KIOPS850 KIOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.5 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF2,000,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length30 mm ± 0.15 mm
Weight3.2 g Max
Environmental
Temperature (Operating)0 ℃ to 85 ℃
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
M.2 타입 2242-S2 / -S3 단면

* 테이블은 가로로 스크롤할 수 있습니다.

Base Model NumberKBG70ZNT2T04KBG70ZNT1T02KBG70ZNT512GKBG70ZNT256G
SED Model NumberKBG7BZNT2T04KBG7BZNT1T02KBG7BZNT512GKBG7BZNT256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2242-S3 Single-sidedM.2 2242-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 2.0d
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s6,400 MB/s
Sequential Write6,000 MB/s5,000 MB/s4,000 MB/s
Random Read1,000 KIOPS850 KIOPS550 KIOPS500 KIOPS
Random Write1,000 KIOPS920 KIOPS850 KIOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.5 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF2,000,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length42 mm ± 0.15 mm
Weight3.8 g Max
Environmental
Temperature (Operating)0 ℃ to 85 ℃
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
M.2 타입 2280-S2 / -S3 단면

* 테이블은 가로로 스크롤할 수 있습니다.

Base Model NumberKBG70ZNV2T04KBG70ZNV1T02KBG70ZNV512GKBG70ZNV256G
SED Model NumberKBG7BZNV2T04KBG7BZNV1T02KBG7BZNV512GKBG7BZNV256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2280-S3 Single-sidedM.2 2280-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 2.0d
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s6,400 MB/s
Sequential Write6,000 MB/s5,000 MB/s4,000 MB/s
Random Read1,000 KIOPS850 KIOPS550 KIOPS500 KIOPS
Random Write1,000 KIOPS920 KIOPS850 KIOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.5 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF2,000,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length80 mm ± 0.15 mm
Weight6.3 g Max
Environmental
Temperature (Operating)0 ℃ to 85 ℃
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.
  • All information provided here is subject to change without prior notice.

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